JUNE 18–22, 2017

Presentation Details

Name: CoolIT Systems: From Chip to Atmosphere - The Future of Data Center Cooling
Time: Tuesday, June 20, 2017
04:40 pm - 05:00 pm
Room:   Booth #M-210  
Breaks:04:45 pm - 05:15 pm Coffee Break
Speaker:   Joerg Desler, STULZ
  Geoff Lyon, CoolIT Systems
Abstract:   Don’t just reject heat, put it to use. Discover how to address heat at the source by harnessing its energy through liquid cooling, and employing it as an integral part of the entire datacenter cooling infrastructure. This session outlines the potential of performance enhancements along with efficiency gains and footprint reductions and elaborates on how scalable such solutions can be in a stand-alone configuration, within Micro-DC’s, as an element of modular DC structures or fully integrated as part of large-scale deployments.