JUNE 18–22, 2017

Presentation Details

Name: RSC Technologies: Universal & Ultra-Compact RSC Tornado Liquid Cooled HPC Solution: Skylake Ready
Time: Tuesday, June 20, 2017
05:20 pm - 05:40 pm
Room:   Booth #M-210  
Speaker:   Alexander Moskovsky, RSC
  Alexey Shmelev, RSC
Abstract:   The universal ultra-compact and energy-efficient RSC Tornado solution for Intel Xeon/Xeon Phi processors accumulates RSC Group’s solid expertise in designing and deploying liquid cooled HPC designs. This design operates at up to +63o C inlet coolant temperature, which enables wide spectrum of options for energy re-use and recuperation (e.g. with adsorption chillers). It is designed with industry-record density (up to 153 nodes/rack), high efficiency (400V DC power supply), redundancy (flexible PSU reservation schemes), modularity (modular redundant CDU), amazing flexibility by different node types on Intel Xeon and Intel Xeon Phi processors (with NVMe SSDs, GPUs, FPGA, VDI as an expansion). The top-bin 72-cores Intel Xeon Phi 7290 processor is also supported with up to 306 CPU/rack as well as liquid cooled high-speed interconnects Intel Omni-Path Architecture, InfiniBand EDR. It is ready to support the upcoming Intel Xeon next generation processor family (codenamed Skylake-EP).