JUNE 18–22, 2017

Presentation Details

Name: Asetek: One Size Does Not Fit All: Adapting Liquid Cooling to Heat Rejection Requirements
Time: Wednesday, June 21, 2017
10:40 am - 11:00 am
Room:   Booth #M-210  
Breaks:10:00 am - 11:00 am Coffee Break
Speaker:   Larry Vertal, Asetek
Abstract:   This session discusses the adaptability of Direct to Chip hot water liquid cooling to a variety of heat capture and heat rejection scenarios that are easily addressed with a high reliability, low pressure distributed pumping architecture.   From using liquid enhanced air cooling of servers in conjunction with traditional data center air cooling to dedicated rack-level CDUs with direct heat transfer to facilities liquid this session informs on the options available.  
Emphasis is placed on the practical, hybrid approach of directly cooling with hot water (Direct-to-Chip) the server components that generate the most heat within a server.
Asetek, with nine HPC clusters in the TOP500, including the most powerful system in Japan, Oak Forest PACs,  the session will also provides an update on various HPC installations worldwide and the resulting impacts from the adoption of distributed liquid cooling.